| 摘要 |
PURPOSE: A semiconductor device including inner power is provided to input/output data stored inside the device and enable data retention even if power from the exterior is disconnected, by including the inner power like a thin film battery in a volatile device like a random access memory(RAM) device. CONSTITUTION: Bonding pads(122) are formed in a semiconductor chip(120). The semiconductor chip is mounted on a substrate having external connection terminals corresponding to the bonding pads. A connection unit electrically connects respective bonding pads with the external connection terminals corresponding to the bonding pads. Molding resin(160) encapsulates an electrical connection part including the semiconductor chip. Connection terminals electrically connect terminals of the bonding pads with the external connection terminals corresponding to the terminals of the bonding pads, interposed between the semiconductor chip and the substrate. |
