| 摘要 |
A semiconductor device including a semiconductor chip having plural electrode pads at the peripheral edge portion thereof, a frame-shaped package substrate in which the semiconductor chip is mounted and which has plural electrode portions corresponding to the respective electrode pads, a lead terminal for connecting each of the electrode pads of the semiconductor chip and each corresponding electrode portion of the package substrate, and sealing resin for sealing the semiconductor chip. In a method of manufacturing the semiconductor device, a lead terminal is connected to each of plural electrode pads of a semiconductor chip while setting a lead connection angle in accordance with the chip size, the lead terminal is cut to a predetermined length in accordance with an electrode forming position of the frame-shaped package substrate on which the semiconductor chip can be mounted, the cut portion of the lead terminal is connected to the electrode portion of the package substrate while the semiconductor chip is mounted on the package substrate, and then the semiconductor chip mounted on the package substrate is sealed with sealing resin.
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