发明名称 |
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
摘要 |
The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the cooling of at least one chip in a sealed semiconductor package. The thermal paste preform is subcooled, and is transferred onto a module component from a separable transfer sheet, or is placed onto the module component using an attached and/or imbedded mesh. The preform of thermal paste may be of simple or complex shape, and enables cooling of one or more chips in a module.
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申请公布号 |
US6444496(B1) |
申请公布日期 |
2002.09.03 |
申请号 |
US20000619886 |
申请日期 |
2000.07.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
EDWARDS DAVID L.;DAVES GLENN G.;FAROOQ SHAJI;IRUVANTI SUSHUMNA;POMPEO FRANK L. |
分类号 |
H01L23/42;H05K7/20;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L21/20;H01L23/34;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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