| 摘要 |
A thermal management device for use with a photolithographic apparatus or tool substantially reducing thermal distortion in a reticle. Planar cooling elements are placed adjacent a reticle being illuminated with extreme ultraviolet, EUV, electromagnetic radiation. A heating element provides heat prior to exposure of the reticle by the EUV electromagnetic radiation and the system is in thermal equilibrium. Upon exposure of the EUV electromagnetic radiation, absorption by the reticle causes heat. The heating element is controlled to reduce the heat provided so the extra heat load generated in the reticle during exposure due to absorption of the EUW electromagnetic radiation is compensated for. The reticle therefore experiences no net heat or thermal energy change, and therefore eliminates or substantially reduces both expansion and thermal gradients in the reticle. The reduction of thermal gradients in the reticle substantially reduces distortion resulting in better imaging of the reticle onto a photosensitive substrate. The present invention is particularly applicable to a scanning photolithographic system used in the manufacture of semiconductors or electronic devices.
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