FORMING METHOD OF MULTILAYER BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing multilayer boards which mainly has a circuit electrode on front and back surfaces with superior productivity. SOLUTION: In this forming method of multilayer boards, the quality of the material in non-sintered sheet 1e, where the back surface is exposed onto the surface of a laminate 1, is made to be different from that of other non- sintered sheets 1a to 1d in the non-sintered sheets 1a to 1e for especially forming the laminate 1. After being subjected burning process, the non-sintered sheet 1e is removed.