| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive pate having excellent soldering property and conductivity. SOLUTION: The conductive paste includes conductive powder, a binder, and a solvent, and the conductive powder is flat-shaped and mostly covered with silver, and exposes a part of copper powder and copper alloy powder, and the conductive particle has an aspect ratio of 3-20, and an average grain diameter of 5-30μm.
|
