发明名称 WIRING BOARD AND ITS TESTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board on which pads are formed as test pads or jumpers by printing or applying a conductive material, and to provide its testing method. SOLUTION: The wiring board 10, provided with conductive patterns on the surface, is further provided with fusible test pats 15, 16, 17 and 19 by printing or applying a conductive material, such that at least one end part thereof is connected with any one of the conductive patterns.
申请公布号 JP2002246719(A) 申请公布日期 2002.08.30
申请号 JP20010043859 申请日期 2001.02.20
申请人 NEC CORP 发明人 NOMURA KENJI
分类号 G01R31/02;G01R31/00;H05K1/11;H05K3/34;(IPC1-7):H05K1/11 主分类号 G01R31/02
代理机构 代理人
主权项
地址