摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board on which pads are formed as test pads or jumpers by printing or applying a conductive material, and to provide its testing method. SOLUTION: The wiring board 10, provided with conductive patterns on the surface, is further provided with fusible test pats 15, 16, 17 and 19 by printing or applying a conductive material, such that at least one end part thereof is connected with any one of the conductive patterns.
|