| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat/electric conductive film for connecting having a low heat resistance, while relaxing a thermal stress of a connecting part, further excellent adhesive properties, a PCT resistance and a heat cycle resistance. SOLUTION: The thermal/electrical conductive film for connecting comprises thermal heat/electric conductors, embedded in a thickness direction of an insulating film or penetrating the film of 3 to 90 vol.% to the film; and in this case, the film has a storage elastic modulus of 0.5 to 5,000 MPa in the range of -70 to 200 deg.C and its application.
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