| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem of a resin sealed electronic device that solder bonding an electronic device element and a lead terminal fuses at the time of solder bonding the resin sealed electronic device to a board and leaks along the lead terminal to the outside of the coating resin. SOLUTION: Resin sealed part of a lead terminal 4 is not subjected to metal plating, boundary part of the lead terminal part and resin where the lead terminal part is exposed from the inside of resin to the outside is not subjected to metal plating, and the surface of the lead terminal 4 is subjected to metal plating at a higher melting point as compared with solder being used for bonding the lead terminal 4 to the electrode part of an electronic device element 3 or solder being used for bonding the device to an electronic circuit board.</p> |
