| 摘要 |
<p>An electronic circuit member (12A) has a thermally conductive layer (22) on a heat sink member (20). The thermally conductive layer (22) includes an insulating substrate (24), a first bonding member (26) containing an active element for jointing the insulating substrate (24) to the heat sink member (20), a second bonding member (28) formed on the insulating substrate (24), and an electrode (30) formed on the second junction member (28). The insulating substrate (24) is formed of an AlN layer or a Si3N4 layer, the first and second bonding members (26) and (28) made of a brazing filler metal containing an active element, and the heat sink member (20) is made of a SiC/Cu composite material or a C/Cu composite material.</p> |
