| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF PREPARING SAME |
| 摘要 |
A semiconductor package comprising a wafer having an active surface comprisi ng at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the active surfa ce of the wafer, provided at least a portion of each bond pad is not covered wi th the silicone layer and wherein the silicone layer is prepared by the method of the invention. |
| 申请公布号 |
CA2438126(A1) |
申请公布日期 |
2002.08.29 |
| 申请号 |
CA20022438126 |
申请日期 |
2002.01.17 |
| 申请人 |
DOW CORNING CORPORATION |
发明人 |
MALENFANT, LOUISE ANN;SARMAH, SATYENDRA KUMAR;GARDNER, GEOFFREY BRUCE;HARKNESS, BRIAN ROBERT;BECKER, GREGORY SCOTT |
| 分类号 |
H01L23/12;G03F7/00;G03F7/075;G03F7/42;H01L23/14;H01L23/31;(IPC1-7):G03F7/00 |
主分类号 |
H01L23/12 |
| 代理机构 |
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