| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide/copper-clad panel obtained by laminating a polyimide layer and a copper layer and having both of good electric characteristics after being placed under a humidified condition and high heat resistance. SOLUTION: The polyimide/copper-clad panel is constituted by laminating a thermally fusible multilayered polyimide layer (a thermally fusible multilayered polyimide layer is included and so forth). An amorphous thermally fusible polyimide layer with a glass transition temperature of 200-330 deg.C is provided on the single surface or both surfaces of a highly heat-resistant polyimide layer, and a copper layer through the thermally fusible polyimide layer. This polyimide/ copper-clad panel has such electric characteristics, that interlaminar insulating resistance measured after 750 hr or more is elapsed under a humidifying condition of 85 deg.C and 85% is not less than 1012Ω. Moisture absorption reflow resistance generating no foaming even if the polyimide/copper clad panel is subjected to reflow treatment at the highest temperature of 240 deg.C or higher, after the absorption of moisture over 24 hr or more at 30 deg.C or higher under a humidifying condition of at least 80%. |
