| 摘要 |
Apparatus for plating heat-resistant articles which includes a hollow reaction chamber having a plurality of wire trays so positioned in the reaction chamber to control the fall of the articles through the chamber, a plurality of spray nozzles so positioned in the walls of the chamber to disperse plating solution throughout the reaction chamber, means for heating the reaction chamber located along the walls thereof, a supply of plating solution connected to the spray nozzles to transfer the solution to the reaction chamber for the plating of the falling articles in the chamber, and a means for continuously recovering the plated articles.
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