发明名称 WIRE ROD FOR LEAD PIN, LEAD PIN FOR PGA AND PGA PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a wire rod for leadpins for PGA(pin grid array) consisting of an Ni based material in which sufficient flexural strength can be obtained even if lead pins are made into fine wires in accordance with their convertion into multipins, and which has high proof strength, to provide lead pins for PGA using the wire rod for leadpins, and to provide a PGA package using the leadpins for PGA. SOLUTION: The wire rod used for leadpins for PGA is made of an Ni based alloy formed of fine grains in which the average grain size is >=9 by the grain size number under JIS G 0551, and having electric conductivity IACS of >=10%. The wire rod has a composition containing, by mass, <=0.1% C and one or more kinds selected from the groups consisting of Ti, Zr, V, Nb, Hf and Ta by 0.001 to 0.3%, and, if required, containing 0.0001 to 0.01% B, and the balance substantially Ni.
申请公布号 JP2002241875(A) 申请公布日期 2002.08.28
申请号 JP20010033933 申请日期 2001.02.09
申请人 HITACHI METALS LTD 发明人 NISHIDA JUNICHI;SATO KOJI
分类号 C22C19/03;H01L23/50;(IPC1-7):C22C19/03 主分类号 C22C19/03
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