发明名称 Polishing pad and surface polishing method
摘要 A workpiece is pinched from above and below by polishing pads attached to the inner surfaces of a pair of upper and lower rotary platens. A slurry is dropped between the workpiece and the polishing pads to polish the workpiece. The polishing pad is comprised of a base layer, and a sheet-shaped nap layer, which is laminated on the base layer and is made of a soft plastic foam. The nap layer is formed of closed pores, whose surface is covered with non-foaming skin layers and which involves pores (air bubble) in the nap layer without opening the pores in the surface. The polishing pad is used in combination with a colloidal slurry whose abrasive grains are colloidal silica in order to polish a surface of the workpiece.
申请公布号 US6439965(B1) 申请公布日期 2002.08.27
申请号 US20000651637 申请日期 2000.08.30
申请人 FUJI ELECTRIC CO., LTD. 发明人 ICHINO MITSUYOSHI;NAKAMURA KOJI;ISHIZAWA YOSHIAKI;ITO YASUSHI;SHIMOBAYASHI TAKAHIRO;IKEMORI GOSUKE;FUJISAWA YUICHIRO
分类号 B24B37/00;B24B29/00;B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24D13/14;G11B5/84;(IPC1-7):B24B1/00;B24B47/02 主分类号 B24B37/00
代理机构 代理人
主权项
地址