发明名称 |
Polishing pad and surface polishing method |
摘要 |
A workpiece is pinched from above and below by polishing pads attached to the inner surfaces of a pair of upper and lower rotary platens. A slurry is dropped between the workpiece and the polishing pads to polish the workpiece. The polishing pad is comprised of a base layer, and a sheet-shaped nap layer, which is laminated on the base layer and is made of a soft plastic foam. The nap layer is formed of closed pores, whose surface is covered with non-foaming skin layers and which involves pores (air bubble) in the nap layer without opening the pores in the surface. The polishing pad is used in combination with a colloidal slurry whose abrasive grains are colloidal silica in order to polish a surface of the workpiece. |
申请公布号 |
US6439965(B1) |
申请公布日期 |
2002.08.27 |
申请号 |
US20000651637 |
申请日期 |
2000.08.30 |
申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
ICHINO MITSUYOSHI;NAKAMURA KOJI;ISHIZAWA YOSHIAKI;ITO YASUSHI;SHIMOBAYASHI TAKAHIRO;IKEMORI GOSUKE;FUJISAWA YUICHIRO |
分类号 |
B24B37/00;B24B29/00;B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24D13/14;G11B5/84;(IPC1-7):B24B1/00;B24B47/02 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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