| 摘要 |
PURPOSE: A semiconductor package structure is provided to improve capacity of a semiconductor package and mounting density by installing two semiconductor chips and two leadframes inside the semiconductor package. CONSTITUTION: An input/output pad is formed on one surface of the first and second semiconductor chips(11,12) and the other surface of the first and second semiconductor chips are attached to each other. A electrical connection unit electrically connects the first semiconductor chip with the second semiconductor chip. The first lead(21) transfers a signal of the first semiconductor chip to the outside, connected to the electrical connection unit. The second lead(22) transfers a signal of the second semiconductor chip to the outside, connected to the electrical connection unit. A heat sink(50) radiates heat to the outside, attached to one surface of the second semiconductor chip. An encapsulation material(40) protects the first semiconductor chip, the second semiconductor chip, the electrical connection unit, the first lead, the second lead and the heat sink from the outer environment. The first lead having a plurality of rows and columns is so exposed to be disposed on the bottom of the encapsulation material. The second lead having a plurality of rows and columns is so exposed to be disposed on the top of the encapsulation material. A solder ball is melted and attached to a portion of the first and second leads exposed to the outside of the encapsulation unit. One surface of the heat sink is exposed to the outside.
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