| 摘要 |
Apparatus and method for mounting electronic components enhanced in mounting efficiency by eliminating loss time are disclosed. In the apparatus and method, electronic components are picked up from a supplying unit of the electronic components by a transfer head, and are mounted on a board. The height of components already mounted on the board being conveyed is measured by a height measuring unit comprising a CCD light sensor including a light emitting unit and a light receiving unit. In mounting operation, the transfer height of the transfer head when moving on the board is set to a height enough to keep an allowance to the already mounted components on the basis of the height measurement of components. As a result, without useless elevating motions of the transfer head, the loss time is eliminated and the mounting efficiency is enhanced.
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