CURABLE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To improve processability of an existing rubber-modified epoxy resin and to stably attain excellent adhesive properties such as peeling strength without detriment to adhesive strength under shear. SOLUTION: The curable composition comprises (A) 100 pts.wt. of an epoxy resin, (B) 1-50 pts.wt. of a polyoxyalkylene-based polymer, and (C) 1-90 pts.wt. of a curing agent for an epoxy resin capable of compatibilizing a mixture of the component (A) and the component (B) at room temperature.