| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board, capable of incorporating electronic components in the circuit board with high positional accuracy. SOLUTION: The method for manufacturing the circuit board comprises the step of first blocking one opening 21a of a through-hole 21 with a pressure sensitive adhesive 24, so that the adhesive 24 is directed toward the inside, so as to dispose a capacitor element 13 in the hole 21. The method further comprises the steps of filling a filling resin 4 in the hole 21, in a state in which the element 13 is adhered to a sheet material 23, when the element 13 is disposed in the hole 21, and causing the resin to cure. Thus, the element 13 can be disposed in the hole 21 with high positional accuracy, that is, inside a circuit board body 3.</p> |
