| 摘要 |
PROBLEM TO BE SOLVED: To provide a disconnection type wafer lift for CVD treatment chambers, and to provide a heater lift system. SOLUTION: The disconnection type lift system comprises a heater lift 104 and a wafer lift 106. The heater lift 104 includes a clamp block 103 having an integrated clamp deflection arm, and a yoke 105 having a clamp screw and a clamp surface. The yoke 105 is inserted into the block 103. The wafer lift 106 includes a lift hoop 110 having keys, a lift pin that is essentially at a right angle to the hoop, and a bellows shaft 108 having keys. The lift hoop 110 having keys and bellows shaft 108 having keys are connected by one clamp screw. A method for using the separation type lift system for treating a substrate is also provided. |
