发明名称 BONDED STRUCTURE USING REACTED BOROSILICATE MIXTURE
摘要 <p>Environmental sensors (2) and other bodies, together with associated lead wires (6), are mounted to a oxidizable substrate (4) for high temperature applications by means of a reacted borosilicate mixture (RBM) (18, 20) that secures the body relative to the substrate via of an oxide interface (22) formed between the RBM and substrate during a high temperature reaction process. An oxide interface (24) is also formed with oxidizable bodies to provide further mounting strength. The RBM is a B203-SiO2 mixture, with the B2O3 portion at least 70 wt.% and preferably at least 75 wt.% for adhesion purposes, and at least 50 wt.% for encapsulation purposes.</p>
申请公布号 WO2002065543(A2) 申请公布日期 2002.08.22
申请号 US2002000276 申请日期 2002.01.07
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