STITCHED PLANE STRUCTURE FOR PACKAGE POWER DELIVERY AND DUAL REFERENCED STRIPLINE I/O PERFORMANCE

摘要

Conductive planes in a power delivery region of a microelectronic package substrate are stitched to correlated conductive planes in a signal region of the substrate. The conductive planes occupy varying horizontal levels of the substrate and are stitched together at a junction between the power delivery region and the signal region of the substrate using alternating tabs connected with vias.