| 摘要 |
<p> A method for producing a plated molded product is provided, in which a surface of a molded product having a thin portion obtained by coinjection molding of resin is subjected to plating. A surface of a molded product having a thin portion obtained by high-speed injection molding of resin is plated by the steps of: (a) forming a metal plating layer on a surface of the molded product by electroless plating; (b) forming a copper plating layer on a surface of the electroless plating layer by electroplating; (c) forming a nickel layer on a surface of the copper plating layer by electroplating; and (d) forming a chromium or chromium alloy layer on a surface of the nickel layer by electroplating. Even for a molded product having a thin portion obtained by high-speed injection molding, a plating which resists removal can be obtained. Further, even when a plating is formed on a satin-finished surface, the plating can reproduce the satin-finished surface.</p> |
