CONTACTING MICROCHIPS BY MEANS OF PRESSURE

摘要

The invention relates to a method for contacting microchips, whereby an adhesive agent is applied to a side of a substrate on which a strip conductor is arranged, and/or to a side of a microchip on which at least one bump is situated, in such a way that a liquid layer of the adhesive agent is formed on the same. After the microchip has been adjusted in such a way that the at least one bump is situated over a pre-determined position on the strip conductor of the substrate, a pressure contact is established between the at least one bump and the pre-determined position by exerting pressure between the microchip and the substrate, said adhesive agent then being hardened.