MEMORY MODULE HAVING BUFFER FOR ISOLATING STACKED MEMORY DEVICES
摘要
The present invention utilizes a buffer to isolate a stack of memory devices, thereby taking advantage of the increased memory density available from stacked memory devices while reducing capacitive loading. A memory module in accordance with the present invention may include a stack of memory devices and a buffer coupled to the first and second memory devices and arranged to capacitively isolate the first and second memory devices from a bus. In a memory system in accordance with the present invention, multiple buffered stacks of memory devices are preferably coupled in a point-to-point arrangement, thereby further reducing capacitive loading.
申请公布号
WO0225454(A3)
申请公布日期
2002.08.22
申请号
WO2001US28627
申请日期
2001.09.14
申请人
INTEL CORPORATION;HALBERT, JOHN;BONELLA, RANDY, M.