FLIP-CHIP BONDING METHOD OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A flip-chip bonding method of a semiconductor package is provided to bond a chip to a substrate, by pressurizing a non-conductive mask to fill a penetration hole with a conductive material and by removing an unnecessary conductive material through a cover. CONSTITUTION: A pair of non-conductive masks having the penetration hole in a position corresponding to each pad of the chip and the substrate(130) are prepared between the chip and the substrate, facing the cover(160). The cover capable of being eliminated is attached to a surface of the non-conductive masks. A conductive material(170) having fluidity is prepared between the masks. The chip and the substrate are pressurized to fill the conductive material in the penetration hole. The cover is eliminated from the mask. The respective masks come in contact with each other and the chip and the mask are pressurized and bonded so that the chip and the mask are interconnected by the conductive material filled in the penetration hole of the respective mask.