Semiconductor apparatus and frame used for fabricating the same

摘要

A semiconductor apparatus includes an insulation tape provided with a device hole therein and a semiconductor chip mounted in the device hole and is provided at a first surface with electrode pads. The apparatus also includes a wiring pattern including leads connected at one ends to the electrode pads; and a heat-radiation member provided on the first surface of the semiconductor chip so that heat generated in the semiconductor chip is radiated outwardly through the heat-radiation member.