| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a slurry tank, the size of a temperature adjusting means, and thermal capacity of the temperature adjusting means, and to enable continuation of processing of a wafer during supply of slurry. SOLUTION: Slurry is circulated between a slurry tank and a temperature adjusting means to adjust the temperature of slurry and the slurry is fed to a wafer polishing device. An amount of slurry fed to the device is detected and slurry in an amount equivalent to the detecting amount is supplied to the tank. The sizes of the slurry tank and the temperature adjusting means can be reduced and heat capacity of the temperature adjusting means can be reduced. Even during supply of slurry, processing of the wafer can be continued. Further, a difference amount between a slurry supply amount and a return amount can be supplied. Recovery and reutilization of the slurry are practicable. |
