发明名称 |
Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
摘要 |
Methods of electrodeposition and electroless deposition are disclosed which afford super-filling of high-aspect ratio features on wafers by exposing wafers and electrolytic solutions in which they are immersed to conditions effective to induce reduction of metal ions in the electrolytic solution, preferably by a multiple step reduction, whereby electrodeposition of metal occurs at a bottom of each of the features until the features are substantially super-filled. Systems for performing such methods are described as are the resulting wafers produced thereby. |
申请公布号 |
AU2002248343(A1) |
申请公布日期 |
2002.08.19 |
申请号 |
AU20020248343 |
申请日期 |
2002.01.14 |
申请人 |
UNIV ROCHESTER |
发明人 |
LOVE JUDITH E;JORNE JACOB;TRAN ANH MAN |
分类号 |
C25D3/02;C25D3/38;C25D7/12;C25D21/14;H01L21/288;H01L21/44;H01L21/768 |
主分类号 |
C25D3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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