ELECTRONIC COMPONENT AND MOUNTING BODY THEREOF

摘要

PROBLEM TO BE SOLVED: To prevent damages due to thermal stress generated between an electronic component and a secondary mounting body and to improve connection reliability. SOLUTION: A groove 108 separating an electrode formation part from peripheral surfaces is provided on the mounting surface 102b of this electronic component 103 on which a semiconductor device 101 is primarily mounted, and/or on the mounting surface 107a of the secondary mounting body 107 on which the electronic component 103 is to be secondarily mounted. Consequently, the thermal stress is dispersed.