SUBSTRATE UNIT, SEMICONDUCTOR ELEMENT, MOUNTING METHOD AND MANUFACTURING METHOD THERE OF

摘要

PROBLEM TO BE SOLVED: To solve a problem that, when electronic components, e.g. a plurality of semiconductor chips, are arranged fixedly on a wiring board through thermosetting adhesive, a positional shift occurs through shrinkage of the adhesive during thermosetting process depending on the state of the adhesive projecting around the semiconductor chip to cause lowering of positional accuracy or damage to a component. SOLUTION: A wiring board 11 is coated with a die bond resin 13 wider by a specified amount that the width WLED of the facing lower surface of an LED array 1 arranged on the wiring board 11 such that uniform fillets 13a and 13b are formed on the long side faces 1a and 1b of the LED array 1. Furthermore, the cavity section between adjacent LED arrays 1 is filled with die bond resin 13 in the arranging direction so that positional shift can be suppressed in that direction.