| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for a large volume in a cap, and to perform a processing from the formation of the cap to the installation of the cap on a mounted substrate, using a simple process and low cost. SOLUTION: The manufacturing method of an electronic device is provided with a process for mounting electronic components 13 on the mounted substrate 11, and a process for installing the cap 50 on the mounted substrate 11. In the process for installing the cap 50 on the mounted substrate 11, a resin film 51F having conductivity is deformed into a shape, having a wall for surrounding the electronic parts 13 on the mounted substrate 11, and an opening part, through which the electronic components 13 pass at the time of storing the electronic components 13 in a space surrounded by the wall by using a jig 38, and it is arranged on the mounted substrate 11, so that it surrounds the electronic components 13 and is brought into contact with a ground conduction part 12G on the mounted substrate 11. Then, the resin film 51F is cured, a cap body 51 is completed, and the cap body 51 is stuck to the mounted substrate 11.
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