| 摘要 |
A testing device is disclosed, including a system circuit board, a first chip component, a supporting structure, a circuit board and an interposer. The system circuit board has a surface where the first chip component is disposed. The first chip component is connected to the system circuit board. The supporting structure is disposed on the surface and surrounds the first chip component; the circuit board is fixed on the supporting structure and keeps distance from the first chip component. The circuit board has a connector for connecting to a chip component that is to be tested. The interposer is located between the circuit board and the first chip component. The circuit board is connected to the first chip component via the interposer. The first chip component need not connect to the chip component to be tested, so is less liable to be damaged by the frequent testing. |
