| 摘要 |
PROBLEM TO BE SOLVED: To shorten a required time for chucking and mounting components and increase mounting efficiency of components. SOLUTION: When a component is mounted by one of a plurality of mounting heads 7 mounted to a head unit 5, at least one of the other mounting heads 7 arranges a component mounting position of a board 2 and a component supplier 4 in a position which can chuck the component from the component supplier 4, and a camera 8 for recognizing components is arranged between the component supplier 4 and the component mounting position, thereby simultaneously carrying out component mounting operations and component chucking operations. |
