| 摘要 |
PROBLEM TO BE SOLVED: To provide a high reliability, by using solders whereby environment of earth is not contaminated, in a semiconductor laser device whereinto a semiconductor laser chip, temperature adjusting components, optical components, and electrical components are integrated. SOLUTION: The manufacturing of the semiconductor laser device has a process for bonding Peltier elements 2 by an Sn-In solder 3 to the bottom surface of a package case 1; a process for bonding a heat spreader 4 by the Sn-In solder 3 onto the Peltier elements 2; and a process for bonding by the Sn-In solder 3 onto the heat spreader 4 a laser stem 5 having a laser chip 6 attached thereto. Thermistors 7 attached to the laser stem 5 and Peltier terminals 27 are attached respectively by Sn-Ag-Cu solders 9 to package terminals 8 plated with the Sn-Ag-Cu solders. The package case 1 is sealed with a cover 11 having a window glass 10 attached thereto.
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