| 摘要 |
PROBLEM TO BE SOLVED: To achieve miniaturization of a semiconductor device with a plurality of semiconductor packages. SOLUTION: The semiconductor device of this invention comprises a first semiconductor package 7 and a second semiconductor package 8 mounted on the first semiconductor package 7. The first semiconductor package 7 includes a land for the second semiconductor package 6 on a front surface and a land 12 for an external connection for the connection with a surface mounting board on the backside surface. The second semiconductor package 8 includes an external lead 10 connected to the land for the second semiconductor package mounting. |
