| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a small and thin package without wires by reducing a mounting area and to provide a method for manufacturing a semiconductor device with a small loss and high efficiency as well. SOLUTION: A semiconductor element is secured on a die pad area of a cathode terminal and an anode terminal is secured to an anode electrode of the semiconductor element by an overhang of a section bar. A compaction of the device can be realized because a non-effective portion between the semiconductor and a lead can be reduced. Furthermore, a height of the device can be suppressed and it is possible to make a thickness of the device thinner by extending the anode electrode to a side surface of the semiconductor and connecting the anode terminal to the side surface. In addition it is possible to provide the method for manufacturing the semiconductor device with the small loss and high efficiency because the bonding wires are not used for connections.</p> |
