发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce leakage current of a semiconductor device having a MOS transistor. SOLUTION: The semiconductor device according to the present invention, which comprises a semiconductor substrate 1 having an active region and an isolation region, a gate electrode 9 formed on the active region via an oxide film 8, and a pair of impurity ranges formed on either side of the gate electrode 9, is characterized in that the surface of the active region has a round shape over the whole and slants downward as an isolation region approaches. The round shape can be formed by connecting bird's beak parts over the active region when a separation oxide film 5 is formed.
申请公布号 JP2002231828(A) 申请公布日期 2002.08.16
申请号 JP20010029779 申请日期 2001.02.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 MAKI YUKIO
分类号 H01L29/78;H01L21/28;H01L21/762;H01L21/8234;H01L21/8244;H01L27/11;H01L29/06;H01L29/423 主分类号 H01L29/78
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