发明名称 METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC PART MOUNTING FILM CARRIER TAPE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic part mounting film carrier tape in which a conductive metal ball is difficult to detach, which is superior in durability and capable of sure electric connection in a film carrier using the conductive metal ball such as a solder ball as an outside terminal. SOLUTION: The film carrier tape forming a wiring pattern on one face of an insulation film is separated at a prescribed distance so as to be opposed to the surface of the film carrier tape, a surface electrode is arranged in a gold plating bath, separated at a prescribed distance so as to be opposed to the backside of the film carrier tape, when the back electrode is arranged and submerged in the gold plating bath, the backside of the film carrier tape is paralleled to a shielding member fixed in the gold plating bath to be shielded, and the plating thickness of the gold plating layer deposited electrolytically on the surface of the electronic part side connection terminal of the film carrier tape is formed thicker than that of the gold plating layer deposited electrolytically on an outside terminal connection part bonded on the conductive metal ball of the backside of the carrier tape.
申请公布号 JP2002231858(A) 申请公布日期 2002.08.16
申请号 JP20010024122 申请日期 2001.01.31
申请人 MITSUI MINING & SMELTING CO LTD 发明人 KURIHARA HIROAKI;YASUI NAOYA
分类号 C25D5/10;C25D5/16;C25D7/00;C25D7/06;H01L21/60;H01L23/12;(IPC1-7):H01L23/12 主分类号 C25D5/10
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