| 摘要 |
PROBLEM TO BE SOLVED: To provide a flame retardant epoxy resin composition which has high flame retardancy without using halogen-based compounds or a phosphorus flame retardant and also improves fluidity and further prevents deterioration of product characteristics, and also to provide a semiconductor using the same. SOLUTION: The flame retardant epoxy resin is prepared by formulating as an essential component an epoxy resin having at least two epoxy groups in one molecule, a curing agent, and a compound with a thermal decomposition temperature of 330-650 deg.C wherein a metallic atom is bonded with an aromatic compound or a heterocyclic compound through ionic or coordinate bond. Preferably, the curing agent (B) comprises a compound or a resin each having at least two phenolic hydroxy groups in one molecule, or the compound (C) has 250-800 deg.C at weight loss of 10% in a thermogravimetric decrease method when temperature is increased at temperature rising rate of 10 deg.C/min in nitrogen atmosphere.
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