FLAME RETARDANT EPOXY RESIN COMPOSITION AND SEMICONDUCTOR-SEALING MATERIAL AND SEMICONDUCTOR DEVICE EACH USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a flame retardant epoxy resin composition which has high flame retardancy without using halogen-based compounds or a phosphorus flame retardant and also improves fluidity and further prevents deterioration of product characteristics, and also to provide a semiconductor using the same. SOLUTION: The flame retardant epoxy resin is prepared by formulating as an essential component an epoxy resin having at least two epoxy groups in one molecule, a curing agent, and a compound with a thermal decomposition temperature of 250-800 deg.C wherein a metallic atom is bonded with an aromatic compound or a heterocyclic compound through ionic or coordinate bond.