发明名称 SEAL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a seal device less prone to generate a clearance in a fitting part even in rise atmospheric temperature in use, to have high heat durability. SOLUTION: This seal device 30 fixes its seal part 31 to an outer ring 2 by a mount part 8, by making it consist of a thermosetting resin which can be injection molded, dimensional contraction and creep deformation due to heat hysteresis are reduced to be different from in the case that the mount part 8 consists of a thermoplastic resin. Accordingly, generation of a clearance between the mount part 8 and the outer ring 2 is made difficult, seal performance between the outer ring 2 and an inner ring 3 can be improved. The thermo-hardening resin has a low resin temperature at molding, different from the thermoplastic resin, when a magnetic sensor 7 and its harness are molded to the mount part 8, a thermal influence given to these electronic parts can be decreased, reliability of the electronic part can be improved.
申请公布号 JP2002227860(A) 申请公布日期 2002.08.14
申请号 JP20010025494 申请日期 2001.02.01
申请人 KOYO SEIKO CO LTD 发明人 ARAI YAMATO
分类号 F16C33/78 主分类号 F16C33/78
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