| 摘要 |
PURPOSE:To grind the outer periphery of the wafer in desired dimensions precisely by a grinding member moving in accordance with the matrix of the wafer. CONSTITUTION:The wafer W is formed by grooving the gallium, gadolinium, garnet and ingot formed through machining in the dimensions obtained by adding a grinding allowance to the outside-diameter dimension of the desired wafer W and the 1st orientation flat (OF) dimension. After the wafer W is held betwen upper and lower boards 4 and 5, a supporting rotary shaft 1 is rotated at a low speed, while the other rotary shaft 2 is rotated at a high speed, and a profile roller 7 is engaged repressively with the matrix 3 formed in the desired dimensions of wafer by the moving operation of the rotary shaft 2 in the radial direction. Simultaneously, when a roller grinder 8 is made to touch the wafer W, the roller grinder 8 moves in accordance with the matrix 3 of the wafer and grinds the wafer W touching the same in the desired dimensions.
|
