发明名称 HEAT RESISTANT RESIN COMPOSITION AND PREPREG AND LAMINATE EACH USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition excellent in heat resistance, dielectric characteristic, adhesiveness and flame retardancy, and also to provide a prepreg and a laminate each using the same. SOLUTION: This heat resistant resin composition contains as an essential component (A) a benzocyclobutene resin or its prepolymer represented by the formula. [wherein, R represents each an alkyl group or an aryl group, -O-, -Si(CH3)2-, -SO2-, -S-, or combination of these], (B) an epoxy modified polybutadiene resin, (C) a halogenated epoxy resin, and (D) a curing agent having a reactive group reacting with an epoxy group.
申请公布号 JP2002226680(A) 申请公布日期 2002.08.14
申请号 JP20010026264 申请日期 2001.02.02
申请人 SUMITOMO BAKELITE CO LTD 发明人 TOBISAWA AKIHIKO
分类号 C08J5/24;C08G59/34;C08G59/50;C08K5/00;C08L63/00;C08L63/08;H05K1/03;(IPC1-7):C08L63/08 主分类号 C08J5/24
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