发明名称 HEAT SINK HAVING HEAT TRANSFER PIPE
摘要 PURPOSE: A heat sink having a heat transfer pipe is provided to increase a heat radiating area in a unit area to improve a heat radiating speed and facilitate manufacture to improve manufacture efficiency. CONSTITUTION: A heat sink comprises a base plate contacting a heat source and having many inserting grooves, and heat transfer pipes. The heat transfer pipes are formed as cylinders, their one ends inserted into the inserting grooves of the base plate. The heat transfer pipes have one or more breathing holes at the middle of the pipes. The breathing holes are formed parallel to each other in the lengthwise direction of the pipes. The cross section of each breathing hole is V-shape. The base plate and the heat transfer pipes are made of copper, aluminium, brass or magnesium. The heat transfer pipes include first heat transfer pipes and second heat transfer pipes shorter than the first transfer pipes. A cooling fan(50) is arranged on the area(60) of the second heat transfer pipes.
申请公布号 KR20020065256(A) 申请公布日期 2002.08.13
申请号 KR20010005685 申请日期 2001.02.06
申请人 EXPAN ELECTRONICS CO., LTD. 发明人 KIM, SEON GI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址