| 摘要 |
A carrier head for a chemical mechanical polishing apparatus has a base, a first flexible membrane extending beneath the base to form a first pressurizable chamber, a support structure positioned in the first chamber, and a compressible film adjacent a bottom surface of the support structure. A lower surface of the first flexible membrane providing a mounting surface for a substrate. The compressible film has a plurality of apertures disposed in a pattern to establish a pressure distribution on a top surface of the first flexible membrane.
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