Method for engagement cutting an imaging element

摘要

The present invention is a method of cutting an imaging element. An imaging element is moved through a cutting zone formed by a first cutting blade having a first cutting surface and a first engaging surface and a second cutting blade having a second cutting surface and a second engaging surface. In the cutting zone the first engaging surface and the second engaging surface are in contact for a distance greater than or equal to a thickness of the imaging element. The first cutting surface and said second cutting surface are separated by from 1 to 30 percent of the thickness of the imaging element in the cutting zone. The present invention reduces debris and skiving generation.