CARBON FIBER BUNDLE, RESIN COMPOSITION, MOLDING COMPOUND AND MOLDED PRODUCT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a carbon fiber bundle having excellent electroconductivity (low surface resistivity and high electromagnetic shielding ability) and convergency, and to provide a resin composition, a molding compound and a molded product each using the same. SOLUTION: This carbon fiber bundle is characterized by being sized with a sizing agent that has the viscosity η1 at 200 deg.C and viscosity η2 at 300 deg.C each determined by a viscoelastometer manufactured by Rheometrics Far East Co. and meeting the relationships: η2<=500 and 1<=η1/η2<=50 and the thermogravimetric retention of >=85% at 300 deg.C when treated under heating from 50 deg.C to 400 deg.C at the rate of temperature up of 10 deg.C/min. The 2nd objective resin composition and the 3rd objective molding compound are each characterized by essentially comprising the above carbon fiber bundles and a thermoplastic resin. The other objective molded product is characterized by being obtained by the use of the above resin composition or molding compound.