| 摘要 |
PROBLEM TO BE SOLVED: To provide a protective sheet for processing semiconductor wafers that gives reduced warpage, even when large-sized wafers are thinned through the back-grinding process and can be easily peeled off through the conventional peeling process. SOLUTION: In the protective sheet for processing semiconductor wafers that comprises the base film and the adhesive layer laminated on the base film, the base film characteristically has 3-150 grams of the repulsion force, when the base material 20 mm wide is bent to 3.0 mm radius of curvature.
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