| 摘要 |
PROBLEM TO BE SOLVED: To prevent tape exfoliation in an outer peripheral part which is to be caused by a tapered shape of a wafer edge and load to a tape when cutting is performed, when the protective tape on a wafer is cut. SOLUTION: A cutter 13 and an outer peripheral sticking roller 9 which includes a heater inside the cutter are arranged on an outer peripheral cutter 2 to be fixed on a lower end portion of a rotation driving mechanism 1. Sticking of an outer peripheral part of a wafer 6 is performed by using an outer peripheral sticking roller 9A, simultaneously with cutting by using the cutter 13.
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